US Patent 11244879 Semiconductor package
Patent 11244879 was granted and assigned to Taiwan Semiconductor Manufacturing Company on February, 2022 by the United States Patent and Trademark Office.
All edits
A semiconductor package including a first semiconductor device, a second semiconductor device, an insulating encapsulant, a redistribution structure and a supporting element is provided. The insulating encapsulant encapsulates the first semiconductor device and the second semiconductor device. The redistribution structure is over the first semiconductor device, the second semiconductor device and the insulating encapsulant. The redistribution structure is electrically connected to the first semiconductor device and the second semiconductor device. The supporting element is embedded in one of the insulating encapsulant and the redistribution structure.
US Patent 11244879 Semiconductor package
Find more entities like US Patent 11244879 Semiconductor package
