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US Patent 11264345 Conductive barrier direct hybrid bonding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
April 12, 2019
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Date of Patent
March 1, 2022
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Patent Application Number
16383455
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Patent Citations
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US Patent 10075657 Edgeless large area camera system
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US Patent 10147641 3D IC method and device
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US Patent 10224241 Copper interconnect structure with manganese oxide barrier layer
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US Patent 10269756 Die processing
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
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US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
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US Patent 10325806 Copper interconnect structure with manganese oxide barrier layer
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US Patent 11011418 3D IC method and device
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US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
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US Patent 11069734 Image sensor device
•••
Patent Citations Received
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US Patent 11973045 Semiconductor structure and method for forming same
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US Patent 11961820 Method for producing a connection between component parts, and component made of component parts
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Patent Inventor Names
Paul M. Enquist
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11264345
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Patent Primary Examiner
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Michelle Mandala
0

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