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US Patent 11264357 Mixed exposure for large die
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Patent
Date Filed
October 20, 2020
Date of Patent
March 1, 2022
Patent Application Number
17075489
Patent Citations Received
US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
US Patent 11626363 Bonded structures with integrated passive component
0
US Patent 11631586 Heterogeneous annealing method
0
US Patent 11631647 Integrated device packages with integrated device die and dummy element
0
US Patent 12125784 Interconnect structures
0
US Patent 12132020 Low temperature bonded structures
0
US Patent 11621246 Diffused bitline replacement in stacked wafer memory
0
US Patent 11652083 Processed stacked dies
0
US Patent 11658173 Stacked dies and methods for forming bonded structures
0
US Patent 11664357 Techniques for joining dissimilar materials in microelectronics
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11264357
Patent Primary Examiner
Elias Ullah
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