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US Patent 11276639 Conductive lines with subtractive cuts

Overview Structured Data Issues Contributors Activity

Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Christopher J. Penny0

Robert Robison0

Nicholas Anthony Lanzillo0

Lawrence A. Clevenger0

Kisik Choi0

Brent Anderson0

Date of Patent

March 15, 2022

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Patent Application Number

167494760

Date Filed

January 22, 2020

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Patent Citations

US Patent 10347506 Multiple patterning method using mask portions to etch semiconductor substrate

Patent Citations Received

US Patent 11791258 Conductive lines with subtractive cuts

Patent Primary Examiner

Caleen O Sullivan

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CPC Code

0

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Integrated chips and methods of forming lines in the same include forming a line layer on a substrate. An opening is etched into the line layer that exposes the substrate. A plug is formed in the opening. The line layer is patterned to form a line that terminates at the plug.

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