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US Patent 11276657 Chiplets with connection posts

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
August 16, 2019
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Date of Patent
March 15, 2022
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Patent Application Number
16543015
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Patent Citations
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US Patent 10750614 Deformable electrical contacts with conformable target pads
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US Patent 10796971 Pressure-activated electrical interconnection with additive repair
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US Patent 10777521 Printable component structure with electrical contact
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US Patent 11064609 Printable 3D electronic structure
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US Patent 10103069 Pressure-activated electrical interconnection by micro-transfer printing
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US Patent 10468391 Inorganic light-emitting-diode displays with multi-ILED pixels
Patent Citations Received
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US Patent 11387178 Printable 3D electronic components and structures
Patent Inventor Names
Carl Prevatte
0
Ronald S. Cok
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Matthew Meitl
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Christopher Bower
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11276657
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Patent Primary Examiner
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David A Zarneke
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CPC Code
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H01L 2224/1144
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H01L 24/04
0
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H01L 24/08
0
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H01L 24/13
0

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