US Patent 11294274 Pellicle assembly and method for advanced lithography
Patent 11294274 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
Amo Chen0
Chih-Cheng Lin0
Hsin-Chang Lee0
Jeng-Horng Chen0
Ta-Cheng Lien0
Yun-Yue Lin0
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Patent Number
112942740
Date of Patent
April 5, 2022
0Patent Application Number
167413420
Date Filed
January 13, 2020
0Official Website
Patent Citations
Patent Primary Examiner
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Article (+429 characters)
US Patent 11294274 Pellicle assembly and method for advanced lithography
Article
The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a porous pellicle frame, a mask with a patterned surface, a first thermal conductive adhesive layer that secures the pellicle membrane to the porous pellicle frame, and a second thermal conductive adhesive layer that secures the porous pellicle frame to the mask.
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Patent applicant
Current assignee
Patent jurisdiction
Patent number
11294274
Date of patent
April 5, 2022
Patent application number
16741342
Date Filed
January 13, 2020
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