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US Patent 11302607 Circuit device
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Patent
Date Filed
June 19, 2018
Date of Patent
April 12, 2022
Patent Application Number
16621105
Patent Citations
US Patent 11069383 Thermal interface materials for immersion cooled data storage devices
US Patent 10998903 Method and apparatus for delivering power to semiconductors
Patent Inventor Names
Hideaki Tahara
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11302607
Patent Primary Examiner
Jarrett J Stark
CPC Code
H01L 25/071
H01L 25/112
H01L 23/467
H02G 3/081
H02G 3/03
H01L 25/0652
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