Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Pouya Hashemi0
Takashi Ando0
Ruilong Xie0
Alexander Reznicek0
Date of Patent
April 12, 2022
Patent Application Number
16821903
Date Filed
March 17, 2020
Patent Citations
Patent Primary Examiner
An embodiment of the invention may include a method for of forming a semiconductor device and the resulting device. The method may include forming a gate dielectric on a gate region of a substrate. The method may include forming an inner dummy gate on a first portion of the gate dielectric. The method may include forming an outer dummy gate adjacent to the inner dummy gate on a second portion of the gate dielectric. The method may include forming spacers adjacent to the outer dummy gate. The method may include removing the outer dummy gate and depositing a first work function metal. The method may include removing the inner dummy gate and depositing a second work function metal.
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