US Patent 11309225 Fan-out package structure and method of manufacturing the same
Patent 11309225 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2022 by the United States Patent and Trademark Office.
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Edits on 16 Oct, 2023
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Patent Inventor Names
Chia-Hung Liu0
Chih-Hsuan Tai0
Chih-Hua Chen0
Hao-Yi Tsai0
Ting-Ting Kuo0
Yu-Chih Huang0
Edits on 8 Oct, 2022
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Patent Citations Received
Edits on 26 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
113092250
Date of Patent
April 19, 2022
0Patent Application Number
167148010
Date Filed
December 16, 2019
0Patent Primary Examiner
Edits on 18 May, 2022
Golden AI
Edits made to:
Infobox (+26 properties)
Article (+526 characters)
US Patent 11309225 Fan-out package structure and method of manufacturing the same
Article
A package structure and a method of manufacturing the same are provided. The package structure includes a die, a redistribution layer (RDL) structure, a through integrated fan-out via (TIV) and a conductive terminal. The RDL structure is disposed on and electrically connected to the die. The TIV is laterally aside the die and extends to contact a bottom surface and a sidewall of a redistribution layer of the RDL structure. The conductive terminal is electrically connected to the die through the RDL structure and the TIV.
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
11309225
Date of patent
April 19, 2022
Patent application number
16714801
Date Filed
December 16, 2019
Patent primary examiner
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