Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Van Le0
Rajashree Baskaran0
Min Suet Lim0
Maruti Gupta Hyde0
Hebatallah Saadeldeen0
Date of Patent
May 3, 2022
0Patent Application Number
161464630
Date Filed
September 28, 2018
0Patent Citations Received
Patent Primary Examiner
Methods and apparatus to provide power management for multi-die stacks using artificial intelligence are disclosed. An example multi-die package includes a computer processor unit (CPU) die, a memory die stacked in vertical alignment with the CPU die, and artificial intelligence (AI) architecture circuitry to infer a workload for at least one of the CPU die or the memory die. The AI architecture circuitry is to manage power consumption of at least one of the CPU die or the memory die based on the inferred workload.
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