Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ming-Ru Chen0
Tzyy-Jang Tseng0
Cheng-Chung Lo0
Date of Patent
May 17, 2022
0Patent Application Number
169071830
Date Filed
June 20, 2020
0Patent Citations Received
Patent Primary Examiner
A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.
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