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US Patent 11341305 Method of predicting shape of semiconductor device

Patent 11341305 was granted and assigned to Samsung on May, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
Samsung
Samsung
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Current Assignee
Samsung
Samsung
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
113413050
Patent Inventor Names
Do-Yun Kim0
Sung-Bo Shim0
Kwang-Hoon Kim0
Ki-Wook Song0
Ji-Hye Lee0
Dong-Chul Ihm0
Woo-Young Cheon0
Date of Patent
May 24, 2022
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Patent Application Number
164332660
Date Filed
June 6, 2019
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Patent Citations
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US Patent 10572697 Method of etch model calibration using optical scatterometry
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US Patent 10712145 Hybrid metrology for patterned wafer characterization
Patent Primary Examiner
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Juan C Ochoa
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CPC Code
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Y02P 90/02
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H01L 22/20
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H01L 22/12
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H01L 21/02
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G06F 2119/18
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G06F 2111/10
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G06F 30/398
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G06F 30/367
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A method of predicting a shape of a semiconductor device includes implementing a modeled semiconductor shape with respect to a designed semiconductor layout, extracting a plurality of samples by independently linearly combining process variables with respect to the modeled semiconductor shape; generating virtual spectrums with respect to ones of the extracted plurality of samples through optical analysis, indexing the virtual spectrums to produce indexed virtual spectrums, generating a shape prediction model by using the indexed virtual spectrums as an input and the modeled semiconductor shape as an output, and indexing a spectrum measured from a manufactured semiconductor device and inputting the spectrum to the shape prediction model to predict a shape of the manufactured semiconductor device.

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