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US Patent 11341305 Method of predicting shape of semiconductor device

Patent 11341305 was granted and assigned to Samsung on May, 2022 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Current Assignee
Samsung
Samsung
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Date Filed
June 6, 2019
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Date of Patent
May 24, 2022
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Patent Applicant
Samsung
Samsung
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Patent Application Number
16433266
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Patent Citations
‌
US Patent 10572697 Method of etch model calibration using optical scatterometry
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US Patent 10712145 Hybrid metrology for patterned wafer characterization
Patent Inventor Names
Do-Yun Kim
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Sung-Bo Shim
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Kwang-Hoon Kim
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Ki-Wook Song
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Ji-Hye Lee
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Dong-Chul Ihm
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Woo-Young Cheon
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11341305
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Patent Primary Examiner
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Juan C Ochoa
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CPC Code
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Y02P 90/02
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H01L 22/20
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H01L 22/12
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H01L 21/02
0
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G06F 2119/18
0
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G06F 2111/10
0
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G06F 30/398
0
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G06F 30/367
0
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G01N 21/9501
0
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H01L 27/0203
0

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