US Patent 11342225 Barrier-free approach for forming contact plugs
Patent 11342225 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
July 31, 2019
Date of Patent
May 24, 2022
Patent Applicant
Patent Application Number
16527389
Patent Citations
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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