US Patent 11348800 Ultra narrow trench patterning with dry plasma etching
Patent 11348800 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 19, 2020
Date of Patent
May 31, 2022
Patent Application Number
17073847
Patent Inventor Names
Chao-Hsuan Chen
0
Yuan-Sheng Huang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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