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US Patent 11356751 High density bezel for patch panel

Patent 11356751 was granted and assigned to CommScope on June, 2022 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent attributes

Patent Applicant

Current Assignee

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Gordon John White0

Brian J. Fitzpatrick0

Shawn Phillip Tobey0

Date of Patent

June 7, 2022

Patent Application Number

16624432

Date Filed

June 19, 2018

Patent Citations

US Patent 10522939 Cover assembly for a telecommunications connector

0

US Patent 10476212 Electrical connector with shield cap and shielded terminals

US Patent 10651608 Connector assembly with grounding clamp system

0

US Patent 10777953 Connector assembly with grounding

US Patent 10784640 Connector with separable lacing fixture

0

US Patent 10958012 Cover assembly for a telecommunications connector

US Patent 10594088 Shielded high density jack

Patent Citations Received

US Patent 11838700 High density bezel for patch panel

0

Patent Primary Examiner

CPC Code

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A telecommunications patch panel system (

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