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US Patent 11356751 High density bezel for patch panel

Patent 11356751 was granted and assigned to CommScope on June, 2022 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 11838700 High density bezel for patch panel
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Patent Inventor Names
Brian J. Fitzpatrick0
Gordon John White0
Shawn Phillip Tobey0
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 US Patent 11356751 High density bezel for patch panel

Article

A telecommunications patch panel system (

Infobox
Is a
Patent
Patent
Patent applicant
CommScope
CommScope
Current assignee
CommScope
CommScope
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
11356751
Date of patent
June 7, 2022
Patent application number
16624432
Date Filed
June 19, 2018
Patent citations
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US Patent 10476212 Electrical connector with shield cap and shielded terminals
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US Patent 10522939 Cover assembly for a telecommunications connector
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US Patent 10594088 Shielded high density jack
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US Patent 10651608 Connector assembly with grounding clamp system
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US Patent 10777953 Connector assembly with grounding
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US Patent 10784640 Connector with separable lacing fixture
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US Patent 10958012 Cover assembly for a telecommunications connector
Patent primary examiner
Edwin A. Leon
Edwin A. Leon
CPC Code
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H04Q 2201/02
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H04Q 1/13
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H04Q 1/09
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H01R 24/64
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H01R 13/745
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H01R 13/659
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H01R 13/6583
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H01R 13/518
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H01R 13/506
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H01R 13/42
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H01R 13/10

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