Patent 11362271 was granted and assigned to Taiwan Semiconductor Manufacturing Company on June, 2022 by the United States Patent and Trademark Office.
The present disclosure relates to a memory device. The memory device includes a first electrode over a substrate and a second electrode over the substrate. A data storage structure is disposed between the first electrode and the second electrode. The data storage structure includes one or more metals having non-zero concentrations that change as a distance from the substrate increases.