Golden has been acquired by ComplyAdvantage.Read about it here ⟶

‌

US Patent 11367697 High-density flip chip package for wireless transceivers

Patent 11367697 was granted and assigned to Qualcomm on June, 2022 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Patent Applicant

Qualcomm

Current Assignee

Qualcomm

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

113676970

Patent Inventor Names

Bhushan Shanti Asuri0

Mohamed Abouzied0

Ibrahim Ramez Chamas0

Date of Patent

June 21, 2022

Patent Application Number

168759720

Date Filed

May 15, 2020

Patent Citations

‌

US Patent 10950542 High-performance variable gain amplifier employing laminate transmission line structures

‌

US Patent 10291283 Tunable radio frequency systems using piezoelectric package-integrated switching devices

‌

US Patent 10566409 Integrated quantized inductor and fabrication method thereof

Patent Primary Examiner

CPC Code

...

An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 11367697 High-density flip chip package for wireless transceivers

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API