US Patent 11367697 High-density flip chip package for wireless transceivers
Patent 11367697 was granted and assigned to Qualcomm on June, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
Bhushan Shanti Asuri0
Ibrahim Ramez Chamas0
Mohamed Abouzied0
Edits on 22 Apr, 2023
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Edits on 26 Sep, 2022
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Patent Applicant
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Patent Jurisdiction
Patent Number
113676970
Date of Patent
June 21, 2022
0Patent Application Number
168759720
Date Filed
May 15, 2020
0Patent Citations
Patent Primary Examiner
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Edits on 24 Sep, 2022
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Edits on 22 Jun, 2022
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Article (+128 characters)
US Patent 11367697 High-density flip chip package for wireless transceivers
Article
An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11367697
Date of patent
June 21, 2022
Patent application number
16875972
Date Filed
May 15, 2020
Patent citations
Patent primary examiner
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