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US Patent 11380635 Semiconductor device
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Patent
Current Assignee
Samsung
Date Filed
December 15, 2020
Date of Patent
July 5, 2022
Patent Applicant
Samsung
Patent Application Number
17121898
Patent Citations
US Patent 11005155 Microwave antenna apparatus and package
US Patent 10103088 Integrated antenna for direct chip attach connectivity module package structures
US Patent 10170838 Antenna-in-package structures with broadside and end-fire radiations
US Patent 10236264 Wireless IC device, resin molded body comprising same, communication terminal apparatus comprising same, and method of manufacturing same
US Patent 10490879 Antenna device and electronic device including the same
US Patent 11165143 Antenna module and electronic system including the same
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11380635
Patent Primary Examiner
Dao H Nguyen
CPC Code
H01L 23/28
H01L 23/485
H01L 24/20
H01L 23/66
H01L 2223/6677
H01L 2924/1421
H01L 2223/6616
H01L 23/5389
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