US Patent 11380666 Fan-out package with cavity substrate
Patent 11380666 was granted and assigned to Taiwan Semiconductor Manufacturing Company on July, 2022 by the United States Patent and Trademark Office.
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Edits on 16 Oct, 2024
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Edits on 25 Apr, 2023
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Current Assignee
Patent Jurisdiction
Patent Number
113806660
Date of Patent
July 5, 2022
0Patent Application Number
170680260
Date Filed
October 12, 2020
0Patent Primary Examiner
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
113806660
Date of Patent
July 5, 2022
0Patent Application Number
170680260
Date Filed
October 12, 2020
0Patent Primary Examiner
Edits on 6 Jul, 2022
Golden AI
Edits made to:
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Article (+458 characters)
US Patent 11380666 Fan-out package with cavity substrate
Article
Structures and methods of forming fan-out packages are provided. The packages described herein may include a cavity substrate, one or more semiconductor devices located in a cavity of the cavity substrate, and one or more redistribution structures. Embodiments include a cavity preformed in a cavity substrate. Various devices, such as integrated circuit dies, packages, or the like, may be placed in the cavity. Redistribution structures may also be formed.
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
11380666
Date of patent
July 5, 2022
Patent application number
17068026
Date Filed
October 12, 2020
Patent primary examiner
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