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US Patent 11384429 Selective cobalt deposition on copper surfaces
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Patent
Current Assignee
Applied Materials
Date Filed
May 18, 2017
Date of Patent
July 12, 2022
Patent Applicant
Applied Materials
Patent Application Number
15598687
Patent Citations
US Patent 10290540 Disubstituted alkyne dicobalt hexacarbonyl compounds, method of making and method of use thereof
US Patent 10008448 Dielectric/metal barrier integration to prevent copper diffusion
US Patent 10043709 Methods for thermally forming a selective cobalt layer
US Patent 10395916 In-situ pre-clean for selectivity improvement for selective deposition
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11384429
Patent Primary Examiner
Robert S Walters, Jr.
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