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US Patent 11387362 Semiconductor device and manufacturing method thereof
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Patent
Date Filed
May 30, 2019
Date of Patent
July 12, 2022
Patent Application Number
16426634
Patent Citations Received
US Patent 11651994 Processes for reducing leakage and improving adhesion
0
US Patent 11955551 Semiconductor device and manufacturing method thereof
0
US Patent 12020983 Processes for reducing leakage and improving adhesion
0
Patent Inventor Names
Gerben Doornbos
0
Georgios Vellianitis
0
Marcus Van Dal
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11387362
Patent Primary Examiner
Herve-Louis Y Assouman
CPC Code
H01L 2029/7858
H01L 29/66545
H01L 29/66742
H01L 29/78684
H01L 29/66439
H01L 29/7848
H01L 29/78618
H01L 29/78696
H01L 29/42392
H01L 21/845
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