Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 19, 2022
Patent Application Number
17370737
Date Filed
July 8, 2021
Patent Citations
Patent Citations Received
Patent Primary Examiner
A glass circuit assembly employing densely packed components is described. Air cooled computer systems employing densely packed circuit components are described. Relating to agile reconfigurable computer systems a high-resolution substrate having an area of at least 100 cm
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