Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wensen Hung0
Kim Hong Chen0
Shin-Puu Jeng0
Szu-Po Huang0
Chi-Hsi Wu0
Hsiang-Fan Lee0
Date of Patent
October 29, 2019
0Patent Application Number
162069030
Date Filed
November 30, 2018
0Patent Citations
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
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