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US Patent 10461009 3DIC packaging with hot spot thermal management features

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
November 30, 2018
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Date of Patent
October 29, 2019
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Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Patent Application Number
16206903
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Patent Citations
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US Patent 10056267 Substrate design for semiconductor packages and method of forming same
Patent Citations Received
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US Patent 12136576 Microelectronic module
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US Patent 11546991 Densely packed electronic systems
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US Patent 10957611 Semiconductor package including lid structure with opening and recess
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US Patent 10966338 Densely packed electronic systems
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US Patent 11037852 3DIC packaging with hot spot thermal management features
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US Patent 11064626 Densely packed electronic systems
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US Patent 11688655 Semiconductor package including lid structure with opening and recess
0
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US Patent 11393807 Densely packed electronic systems
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US Patent 11445640 Water cooled server
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US Patent 11523543 Water cooled server
Patent Inventor Names
Wensen Hung
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Kim Hong Chen
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Shin-Puu Jeng
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Szu-Po Huang
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Chi-Hsi Wu
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Hsiang-Fan Lee
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10461009
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Patent Primary Examiner
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S. V. Clark
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