US Patent 11396045 Monitoring during additive manufacturing process using thermocouples
Patent 11396045 was granted and assigned to The Aerospace Corporation on July, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
Dhruv N. Patel0
Joseph T. Case0
Shant Kenderian0
Tait DeWitt McLouth0
Edits on 26 Apr, 2023
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
113960450
Date of Patent
July 26, 2022
0Patent Application Number
162990210
Date Filed
March 11, 2019
0Patent Citations
Patent Primary Examiner
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Edits on 27 Jul, 2022
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Article (+254 characters)
US Patent 11396045 Monitoring during additive manufacturing process using thermocouples
Article
A build plate may include one or more thermocouples placed on an underside of the build plate. The one or more thermocouples output temperature fluctuation to assist in monitoring for build plate separation of a product located on top of the build plate.
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11396045
Date of patent
July 26, 2022
Patent application number
16299021
Date Filed
March 11, 2019
Patent citations
Patent primary examiner
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