Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 26, 2022
Patent Application Number
17108399
Date Filed
December 1, 2020
Patent Citations
Patent Primary Examiner
CPC Code
An electronic package is provided, which is disposed with a second electronic component and a third electronic component on a first electronic component as a carrier structure, such that there is no need to match a layout size of the conventional package substrate. Therefore, the first electronic component can be designed as a System on a Chip (SoC) with a smaller size to improve the process yield.
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