US Patent 11398429 Electronic package and manufacturing method thereof
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Edits on 1 Apr, 2023
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Patent Jurisdiction
Patent Number
113984290
Date of Patent
July 26, 2022
0Patent Application Number
171083990
Date Filed
December 1, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
Edits on 27 Mar, 2023
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Edits on 26 Sep, 2022
Golden AI
Infobox
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Patent Jurisdiction
Patent Number
113984290
Date of Patent
July 26, 2022
0Patent Application Number
171083990
Date Filed
December 1, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
Edits on 27 Jul, 2022
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US Patent 11398429 Electronic package and manufacturing method thereof
Article
An electronic package is provided, which is disposed with a second electronic component and a third electronic component on a first electronic component as a carrier structure, such that there is no need to match a layout size of the conventional package substrate. Therefore, the first electronic component can be designed as a System on a Chip (SoC) with a smaller size to improve the process yield.
Infobox
Is a
Patent jurisdiction
Patent number
11398429
Date of patent
July 26, 2022
Patent application number
17108399
Date Filed
December 1, 2020
Patent citations
Patent primary examiner
CPC Code
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