Patent attributes
A light emitting device package includes: a plurality of light emitting structures, each having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; a common first electrode extended in parallel with first and second surfaces of the plurality of light emitting structures at a level different from levels of the first and second surfaces while connecting respective first conductivity-type semiconductor layers of the plurality of light emitting structures; a plurality of second electrodes connected to respective second conductivity-type semiconductor layers of the plurality of light emitting structures; a plurality of wavelength converters; and a molded portion having a partition wall structure separating the plurality of wavelength converters from each other, and including a material having a modulus lower than a modulus of the plurality of light emitting structures.
