Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
John Ritter0
Jonathan David Payne0
Date of Patent
August 9, 2022
Patent Application Number
17035643
Date Filed
September 28, 2020
Patent Citations
Patent Primary Examiner
A method for filling a through slit in a metal layer for use in a metallic smartcard by providing a metal sheet having at least one through slit extending through the thickness of the metal sheet, applying a polymer resin to the metal sheet so as to substantially fill the slit(s), and curing the resin. A coupling frame for a smartcard, and a smartcard are also provided.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
