US Patent 11410013 Method of filling a slit in a metallic smartcard
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John Ritter0
Jonathan David Payne0
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US Patent 11410013 Method of filling a slit in a metallic smartcard
Article
A method for filling a through slit in a metal layer for use in a metallic smartcard by providing a metal sheet having at least one through slit extending through the thickness of the metal sheet, applying a polymer resin to the metal sheet so as to substantially fill the slit(s), and curing the resin. A coupling frame for a smartcard, and a smartcard are also provided.
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Patent number
11410013
Date of patent
August 9, 2022
Patent application number
17035643
Date Filed
September 28, 2020
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