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US Patent 11424204 Semiconductor component and manufacturing method thereof

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Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11424204
Date of Patent
August 23, 2022
Patent Application Number
16928089
Date Filed
July 14, 2020
Patent Citations
‌
US Patent 10038025 Via support structure under pad areas for BSI bondability improvement
‌
US Patent 10109666 Pad structure for backside illuminated (BSI) image sensors
Patent Primary Examiner
‌
Dale E Page
CPC Code
‌
H01L 24/05
‌
H01L 24/03
‌
H01L 2224/0311
‌
H01L 2224/05551

A semiconductor component is provided. The semiconductor component includes a substrate and a pad. The pad has an upper surface and a slot, wherein the slot is recessed with respect to the upper surface.

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