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US Patent 11424204 Semiconductor component and manufacturing method thereof
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Patent
Date Filed
July 14, 2020
Date of Patent
August 23, 2022
Patent Application Number
16928089
Patent Citations
US Patent 10038025 Via support structure under pad areas for BSI bondability improvement
US Patent 10109666 Pad structure for backside illuminated (BSI) image sensors
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11424204
Patent Primary Examiner
Dale E Page
CPC Code
H01L 24/05
H01L 24/03
H01L 2224/0311
H01L 2224/05551
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