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US Patent 11430740 Microelectronic device with embedded die substrate on interposer

Patent 11430740 was granted and assigned to Intel on August, 2022 by the United States Patent and Trademark Office.

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United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Kristof Darmawikarta0

Robert L. Sankman0

Sheng Li0

Sri Ranga Sai Boyapati0

Amruthavalli Pallavi Alur0

Islam A. Salama0

Robert Alan May0

Date of Patent

August 30, 2022

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Patent Application Number

164740260

Date Filed

March 29, 2017

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Microelectronic devices with an embedded die substrate on an interposer are described. For example, a microelectronic device includes a substrate housing an embedded die. At least one surface die is retained above a first outermost surface of the substrate. An interposer is retained proximate a second outermost surface of the substrate.

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