Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chen-Hua Yu0
Cheng-Chieh Hsieh0
Der-Chyang Yeh0
Hsien-Wei Chen0
Ming-Yen Chiu0
Shin-Puu Jeng0
Date of Patent
December 25, 2018
Patent Application Number
15243694
Date Filed
August 22, 2016
Patent Citations Received
0
Patent Primary Examiner
Patent abstract
A first package is bonded to a first substrate with first external connections and second external connections. The second external connections are formed using materials that are different than the first external connections in order to provide a thermal pathway from the first package. In a particular embodiment the first external connections are solder balls and the second external connections are copper blocks.
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