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US Patent 11894311 Microelectronic device with embedded die substrate on interposer

Patent 11894311 was granted and assigned to Intel on February, 2024 by the United States Patent and Trademark Office.

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Patent Applicant

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Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Kristof Darmawikarta0

Sheng Li0

Amruthavalli Pallavi Alur0

Robert L. Sankman0

Sri Ranga Sai Boyapati0

Islam A. Salama0

Robert Alan May0

Date of Patent

February 6, 2024

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Patent Application Number

177169550

Date Filed

April 8, 2022

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Patent Citations

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US Patent 9595509 Stacked microelectronic package assemblies and methods for the fabrication thereof

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US Patent 9673131 Integrated circuit package assemblies including a glass solder mask layer

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Patent abstract

A microelectronic device is formed to include an embedded die substrate on an interposer; where the embedded die substrate is formed with no more than a single layer of transverse routing traces. In the device, all additional routing may be allocated to the interposer to which the embedded die substrate is attached. The embedded die substrate may be formed with a planarized dielectric formed over an initial metallization layer supporting the embedded die.

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