US Patent 11894311 Microelectronic device with embedded die substrate on interposer
Patent 11894311 was granted and assigned to Intel on February, 2024 by the United States Patent and Trademark Office.
All edits
Edits on 9 Feb, 2024
Golden AI
Edits made to:
Infobox (+73 properties)
Article (+474 characters)
US Patent 11894311 Microelectronic device with embedded die substrate on interposer
Article
Patent abstract
A microelectronic device is formed to include an embedded die substrate on an interposer; where the embedded die substrate is formed with no more than a single layer of transverse routing traces. In the device, all additional routing may be allocated to the interposer to which the embedded die substrate is attached. The embedded die substrate may be formed with a planarized dielectric formed over an initial metallization layer supporting the embedded die.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Amruthavalli Pallavi Alur0
Islam A. Salama0
Kristof Darmawikarta0
Robert Alan May0
Robert L. Sankman0
Sheng Li0
Sri Ranga Sai Boyapati0
Date of Patent
February 6, 2024
0Patent Application Number
177169550
Date Filed
April 8, 2022
0Patent Citations
Patent Primary Examiner
CPC Code
Find more entities like US Patent 11894311 Microelectronic device with embedded die substrate on interposer
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
