Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kei Murayama0
Shinji Nakajima0
Date of Patent
September 27, 2011
Patent Application Number
12241238
Date Filed
September 30, 2008
Patent Citations Received
Patent Primary Examiner
Patent abstract
There is provided a wiring board. The wiring board includes: a semiconductor substrate having a through hole and covered with an insulating film; a through electrode formed in the through hole; a first wiring connected to one end of the through electrode; and a second wiring connected to the other end of the through electrode. The semiconductor substrate includes: a semiconductor element and a first guard ring formed to surround the through hole. The semiconductor element includes a first conductivity-type impurity diffusion layer having a different conductivity-type from that of the semiconductor substrate and is electrically connected to the first wiring and the second wiring.
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