Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jae Sik Lee0
Dong Wook Kim0
Hong Bok We0
Date of Patent
September 13, 2016
0Patent Application Number
146734350
Date Filed
March 30, 2015
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
An integrated circuit (IC) package structure may include a substrate. The substrate may include a semiconductor bridge having a first surface directly on a surface of the substrate that faces a first semiconductor die and a second semiconductor die. The semiconductor bridge may be disposed within a cavity extending through a photo-sensitive layer on the surface of the substrate. The semiconductor bridge may have an exposed, second surface substantially flush with the photo-sensitive layer. The first semiconductor die and the second semiconductor die are supported by the substrate and coupled together through the semiconductor bridge.
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