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US Patent 9443824 Cavity bridge connection for die split architecture

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 30, 2015
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Date of Patent
September 13, 2016
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Patent Application Number
14673435
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Patent Citations Received
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US Patent 12124095 Optical multi-die interconnect bridge with optical interface
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US Patent 11749607 Package and method of manufacturing the same
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US Patent 11764158 Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
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US Patent 11764177 Bonded structure with interconnect structure
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US Patent 12125793 Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications
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US Patent 11854983 Semiconductor devices and methods of manufacture
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US Patent 11894311 Microelectronic device with embedded die substrate on interposer
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US Patent 11935907 Image sensor device
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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
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US Patent 12027448 Open cavity bridge power delivery architectures and processes
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•••
Patent Inventor Names
Jae Sik Lee
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Dong Wook Kim
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Hong Bok We
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9443824
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Patent Primary Examiner
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Hoai V Pham
0

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