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US Patent 8901748 Direct external interconnect for embedded interconnect bridge package

Patent 8901748 was granted and assigned to Intel on December, 2014 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8901748

Date of Patent

December 2, 2014

Patent Application Number

13828947

Date Filed

March 14, 2013

Patent Citations Received

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US Patent 12132002 Bridge interconnection with layered interconnect structures

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US Patent 12087700 Embedded die microelectronic device with molded component

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US Patent 12113056 Stacked dies and methods for forming bonded structures

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US Patent 11688692 Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias

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US Patent 11694960 Bridge interconnection with layered interconnect structures

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US Patent 11749606 Embedded bridge substrate having an integral device

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US Patent 11764177 Bonded structure with interconnect structure

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Patent Primary Examiner

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Ida M. Soward

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