Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Amit Kumar Jain
Kevin Joseph Doran
Chin Lee Kuan
Sameer Shekhar
Dong-Ho Han
Date of Patent
September 5, 2023
Patent Application Number
17371293
Date Filed
July 9, 2021
Patent Citations
Patent Primary Examiner
Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate; a bridge, embedded in the package substrate, wherein the bridge includes an integral passive component, and wherein a surface of the bridge include first contacts in a first interconnect area and second contacts in a second interconnect area; a first die coupled to the passive component via the first contacts in the first interconnect area; and a second die coupled to the second contacts in the second interconnect area.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.