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US Patent 10163861 Semiconductor package for thermal dissipation

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
August 22, 2016
Date of Patent
December 25, 2018
Patent Application Number
15243694
Patent Citations Received
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US Patent 11430740 Microelectronic device with embedded die substrate on interposer
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US Patent 11769752 Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods
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US Patent 11894311 Microelectronic device with embedded die substrate on interposer
0
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US Patent 10600739 Interposer with interconnects and methods of manufacturing the same
0
Patent Inventor Names
Chen-Hua Yu
0
Cheng-Chieh Hsieh
0
Der-Chyang Yeh
0
Hsien-Wei Chen
0
Ming-Yen Chiu
0
Shin-Puu Jeng
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10163861
Patent Primary Examiner
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Dung A. Le

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