Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 13, 2022
Patent Application Number
17018797
Date Filed
September 11, 2020
Patent Citations
Patent Primary Examiner
In an embodiment, a method of manufacturing a semiconductor device includes preparing a deposition processing chamber by flowing first precursors to form a dielectric coat along an inner sidewall of the deposition processing chamber and flowing a second precursor to form a hydrophobic layer over the dielectric coat. In addition one or more deposition cycles are performed. Next, the second precursor is flowed again to repair the hydrophobic layer.
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