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US Patent 11444002 Package structure

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Infobox
Patent Citations
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US Patent 10297573 Three-dimensional package structure and the method to fabricate thereof
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Infobox
Is a
Patent
Patent
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Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
114440020
Date of Patent
September 13, 2022
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Patent Application Number
169415410
Date Filed
July 29, 2020
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Patent Citations
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US Patent 10141496 Device housing with vibrator component
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US Patent 10297573 Three-dimensional package structure and the method to fabricate thereof
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US Patent 10276382 Semiconductor device packages and stacked package assemblies including high density interconnections
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US Patent 10354984 Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same
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US Patent 10403609 System-in-package devices and methods for forming system-in-package devices
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US Patent 10418308 Systems and methods for coupling a semiconductor device of an automation device to a heat sink
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US Patent 10515806 Semiconductor device packages and stacked package assemblies including high density interconnections
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US Patent 10535521 Semiconductor device packages and stacked package assemblies including high density interconnections
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US Patent 10652997 Switching power supply device
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US Patent 10825696 Cross-wafer RDLs in constructed wafers
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US Patent 10861770 Power module and semiconductor apparatus
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US Patent 10916429 Semiconductor device packages and stacked package assemblies including high density interconnections
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US Patent 10950538 Semiconductor structure and manufacturing method thereof
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US Patent 10978373 Semiconductor device methods of manufacture
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US Patent 10978382 Integrated circuit package and method
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US Patent 10985101 Semiconductor package and manufacturing method thereof
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US Patent 11004758 Integrated circuit package and method
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US Patent 11011451 Integrated circuit package and method
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US Patent 11062975 Package structures
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Patent Primary Examiner
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Bo B Jang
0
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