Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11444002 Package structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Date Filed
July 29, 2020
Date of Patent
September 13, 2022
Patent Application Number
16941541
Patent Citations
‌
US Patent 10354984 Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same
‌
US Patent 10403609 System-in-package devices and methods for forming system-in-package devices
‌
US Patent 10418308 Systems and methods for coupling a semiconductor device of an automation device to a heat sink
‌
US Patent 10515806 Semiconductor device packages and stacked package assemblies including high density interconnections
‌
US Patent 10535521 Semiconductor device packages and stacked package assemblies including high density interconnections
‌
US Patent 10652997 Switching power supply device
‌
US Patent 10825696 Cross-wafer RDLs in constructed wafers
‌
US Patent 10861770 Power module and semiconductor apparatus
‌
US Patent 10916429 Semiconductor device packages and stacked package assemblies including high density interconnections
‌
US Patent 10950538 Semiconductor structure and manufacturing method thereof
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11444002
Patent Primary Examiner
‌
Bo B Jang

Find more entities like US Patent 11444002 Package structure

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo