US Patent 11447887 Surface smoothing of copper by electropolishing
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Edits on 30 Jul, 2023
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Patent Number
114478870
Date of Patent
September 20, 2022
0Patent Application Number
171181150
Date Filed
December 10, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
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Patent Number
114478870
Date of Patent
September 20, 2022
0Patent Application Number
171181150
Date Filed
December 10, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
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US Patent 11447887 Surface smoothing of copper by electropolishing
Article
A method for forming an atomically smooth surface on a copper electrode through electropolishing and the atomically smooth surface are provided. An exemplary method for forming an atomically smooth surface by electropolishing includes placing a copper foil in an electrolyte solution including ethylene glycol and phosphoric acid. The copper foil is coupled to a current source. Current is applied to the copper foil to electropolish the copper foil. The electropolishing is stopped when the electropolishing is completed.
Infobox
Is a
Patent Jurisdiction
Patent Number
114478870
Date of Patent
September 20, 2022
0Patent Application Number
171181150
Date Filed
December 10, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
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