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US Patent 11447887 Surface smoothing of copper by electropolishing
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Patent
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Date Filed
December 10, 2020
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Date of Patent
September 20, 2022
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Patent Application Number
17118115
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Patent Citations
US Patent 10161051 Electrochemical reduction of CO2 at copper nanofoams
US Patent 10590548 Methods and systems for fuel production
US Patent 10131602 Catalytic methanol formation from carbon dioxide with a templated indium catalyst
US Patent 10329677 Method for electrochemical reduction of carbon dioxide
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11447887
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Patent Primary Examiner
Brian W Cohen
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CPC Code
C25F 3/22
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